Earphone Main Board, Headphone PCB, Ear Cup Circuits Board, Headset PCB Board, Rigid Flex PCB

Earphone Main Board, Headphone PCB, Ear Cup Circuits Board, Headset PCB Board, Rigid Flex PCB

Layer count: 4
Material: FR4 + Polymide,1.6mm, 1 OZ  for all layer
Minimum tack: 3mil
Minimum space(gap): 3mil
Minimum hole: 0.30mm
Surface finished: ENIG( Au 2 U")
Panel size:220*230mm/8up
Characteristics: rigid flex multilayer PCB, earphone main board

Rigid flex circuits board

Earphone.