8 SMT mass production lines for machine capacity 16 million solder points per day.
3 prototype SMT production lines, 3-5 day delivery
6 DIP(through hole wave-soldering) production lines, 50K-60K panels per day.
SMT Capability:
Min chip packing: 01005
BGA Pitch: =< 0.35mm
Lead Pitch: =<0.3mm
