Technical Road Map

Technical Road Map

Items 2015 2016 2017
max layer 42 46 48
max board size 600*1000mm 600*1000mm 600*1000mm
max board thickness 10.0mm 10.0mm 10.0mm
min board thickness 0.05mm 0.05mm 0.05mm
max finished copper thickness 13 OZ 13 OZ 13 OZ
min track/gap 50/50UM 30/30UM 15/15UM
min mechanical hole 0.15mm 0.15mm 0.15mm
min laser hole 0.075mm 0.075mm 0.075mm
aspect ratio 18:01 18:01 18:01
impedance tolerance +/-8% +/-5% +/-5%
HDI capability 4+N+4 6+N+6 any layer
flexible PCB mass production mass production mass production
rigid flex PCB mass production mass production mass production
IC Substrates mass production mass production mass production
Special technologies Tenting, Etch Back,Buss-less Tenting, Etch Back,Buss-less,MSAP,SAP Tenting, Etch Back,Buss-less,MSAP