The semiconductor producing area comprises of four essential cycles: semiconductor plan, wafer handling, wafer bundling

IPC-6012D or IPC 4671 VII standard for Via on PAD, Adhesion of the metallized coating to the via fill and copper pad. Copper thickness. The planarity between the fill material and the copper surface. CTE mismatch between

In general, the probe card is considered disposable, and maintenance is essential to ensure its performance and usefulness

What is the difference between a semiconductor test board and a standard PCB? A semiconductor test board is specially intended to test

IC substrates can be classed according to materials, structure, and fabrication techniques. Below are some typical classes of IC substrates:

Along with the rapid growth of extremely large-scale integrated circuits (ICs), existing package types can never meet

The term Server PCB often refers to the Printed Circuit Board used in servers or server-related gear

Gadgets Assembling Administration (EMS) alludes to a scope of administrations that envelop the plan, assembling

Low-volume PCB assembly, also known as small volume PCB assembly, is the assembly of printed circuit boards

In the consistently developing universe of innovation, the printed circuit assembly (PCA) industry is at the bleeding