Keywords: HDI PCB Manufacturing
High density interconnects or HDI circuit boards are Printed Circuit Board with higher wire density per unit area than normal printed circuit boards. In general, HDI PCBs are defined as PCBs with one or all of the following: microvias; blind and buried vias; built-up laminations and aspects of signal performance. The printed circuit board technology has been continuously improving its technology for different technologies that require small and faster boards. HDI boards after HDI PCB Manufacturing are thinner, and utilize miniature via and pad, mini copper traces, and mini spaces. So, HDIs employ denser wiring leading to lighter weight, compact, and lower layer count PCB.
At EFPCB, we aim at delivering the highest quality of the printed circuit boards available in a broad range of the various design characteristics relevant to your particular project; we offer a printed circuit board up to 36 layers and the copper weight of up to 20oz. A boards that needs up to 2oz of copper or up to 24 layers, the EFPCB’ Instant Online Quote Engine can give a quote for but for boards that need 3 - 20oz of copper or 25- 36 layers, a custom quote is needed. As for HDI PCBs with blind and buried vias, the quotations would be customer based and to place an order.
The first advantage hardcare developed uses the printed circuit boards Types of, is their ability to do more using less; through improvement of etching copper technology for better precision, it became possible to miniaturize functions of multiple PCBs on one HDI PCB.
Very much shortening the distances between devices and trace spaces, HDI PCBs also pave way for the deployment of a great number of transistors in the electronic equipment to enhance on their performances and building circuits which have low power consumptions. We also get better signal integrity due to short distance connections and low power consumption.
Additionally, consider using a HDI-printed circuit board for the following benefits:
Cost-effectiveness: as it has been mentioned, overall costs are lower because of less number of layers and smaller sizes/less boards compared with standard PCBs if the plan is developed well.
Faster time-to-market: The trends in the area relate to design efficiencies in terms of time-to-market for the HDI PCB. Owing to the component and via placement aspects and electrical characteristics, it requires a relatively small period of time to design and check HDI PCBs.
Better reliability: Microvias are more reliable than the standard through-hole due to the aspect ratio; are more dependable than through holes, facilitating HDIs to have a better performance with better material and parts.
Application
This kind of PCB is usually used in sophisticated electronics items that require high performance as well as moderate and minimal space. The use of such technologies is in communication devices like mobile or cellular phones touch screen via devices like the laptop-computers, digital cameras, 4/5G network communication, military uses including avionics and smart munition.
Carron and aviation industries, which require high density printed circuit boards to be as light as possible in order for the equipment they are manufacturing to operate at optimum efficiency, have been using HDI PCBs at a rather higher pace. The automobile industry is gradually integrating the conventional cars with communication technology and computer systems. Contemporary automobiles possess approximately fifty computer chips that are involved in driving regulation, diagnosis, protection mechanisms and other comforts. Most of the features like onboard WiFi & GPS, rearview Cameras & Backup sensors all use the HDI PCBs. Over time, advancement in automotive technology grows and is likely to witness HDI tech as a key component.
Another application area found to be heavily employing HDI PCBs is in medical instruments; complicated electronic medical instruments like diagnostic tools or monitoring and imaging devices, surgical tools, or diagnostic tests always include HDI boards. The densely developed technology enhances efficiency and development of small, cheap devices possibly resulting in determinate monitoring as well as medical diagnosis.
Industrial automation needs a lot of computerization and IoT devices are being used increasingly in manufacturing, logistics, and other industries. Most of these advanced equipment use HDI technology Most of these advanced equipment use HDI technology. In current business management, there is use of electronic devices for tracking stocks and assessing the performance of tools. Specifically, advanced machinery entails the use of smart sensors used for data acquisition of equipment use while the sensors themselves connect to the internet and share relevant data to other smart devices as well as the management for efficiency in performance.
HDI board has dense dedicated land, while ordinary PCB only has several small copper sections.
HDI board stands for high-density interconnected HDI circuit board employing micro-blind buried hole technology processing. It has the inner line and outer line, but the HDI board and ordinary PCB multilayer board are different in that the HDI board may have blind or buried holes, while the ordinary PCB is through-hole so that the connection of each layer of the line. HDI board blind and buried holes have been mentioned in the previous article, the following to see different of HDI board and ordinary PCB board in which?
The mainstream of the ordinary PCB board is FR-4, which is epoxy resin and electronic grade glass cloth, drilling is mainly mechanical drilling, and the minimum hole diameter is generally not less than 0.15mm. While the HDI board is laser drilling, also known as laser drilling, which can process 3-4mil micro-hole, and the accuracy rate is higher than the cost of mechanical drilling micro-hole. This is the reason why
HDI board is a type of high density interconnection blind buried hole multilayer board, which usually adopts accumulation process When the layers are accumulated, the higher the technical level of the board. The ordinary HDI board is approximately equal to 1 times the layering that we call the first tier HDI, the high order HDI using 2 or more times layering technology while also utilizing more advanced and high-precision micro-vias, plating filled blind holes capabilities, laser direct ablation and other PCB manufacturing technologies.
HDIPS: High Density Interconnect Printed Circuit Board Structures
There are various ways through which HDI Printed Circuit Boards can adopt various types of layering so as to meet the optimal design specifications.
HDI PCB (1+N+1): Simplest HDI
Contour structure of this type of HDI PCBs consists of one “build-up” of high density interconnection layers which is good for BGA with relatively low number of input/output contacts.
Applications: Cell phone: MP3 player: GPS: Memory card.
HDI PCB (2+N+2): Moderate Complex HDI
As for this structure of HDI PCB, 2 or more build-up of HDI layers are included; the microvias in different layers may be staggered or stacked; Copper filled stacked microvia structures are frequent in complex designs, which require high level signal transmission performance.
Applications: Candy bar/mobile phone, personal digital assistant, game player, portable video recorder.
ELIC (Every Layer Interconnection): Most Complex HDI
In this HDI PCB Manufacturing structure, all the layers are high density interconnection layers by which the conductors on any layer of the PCB can be connected with copper filled stacked microvia structures at any layer of the PCB.
This offers a feasible solution for intricate large pin count devices like CPU and GPU used in hand and mobile systems as well as offering enhanced electrical performance.
