Birn in Board (BIB)

Birn in Board (BIB)
Birn in Board (BIB)

Layer count:  32 layer
Material: FR4, 3.8 mm, 1 OZ for all layer
Minimum trace: 3 mil
Minimum space(gap): 3 mil
Minimum hole: 0.20mm
Surface finished: full board Hard Gold (Au>=30U")
Panel size: 428*568mm/1up
Characteristics: High TG PCB,  high multilayer PCB, hard gold PCB, IPC 6012 Class 3 PCB

High TG PCB, High multilayer PCB, Hard gold PCB

Birn in Board (BIB)

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