Layer count: 6 HDI PCB
Material: FR4 , 1.0 mm, High TG, 0.5 OZ  for all layer
Minimum tack: 2 mil
Minimum space(gap): 2 mil
Minimum hole: 0.15mm
Surface finished: ENIG
Panel size: 220*268mm/4up
Characteristics: high density interconnect PCB, via on pad(plug with resin, copper capping), high TG, thin core 3mil thickness