HDI Printed Circuit Board

HDI Printed Circuit Board

Layer count: 6 HDI PCB
Material: FR4 , 1.0 mm, High TG, 0.5 OZ  for all layer
Minimum tack: 2 mil
Minimum space(gap): 2 mil
Minimum hole: 0.15mm
Surface finished: ENIG
Panel size: 220*268mm/4up
Characteristics: high density interconnect PCB, via on pad(plug with resin, copper capping), high TG, thin core 3mil thickness

High Density Interconnect PCB, Via on Pad( plug with resin, copper capping ), High TG, Thin core PCB. 

Communication Equipment