micro via PCB | multilayer PCB
micro via PCB, multilayer PCB
Layer count: 6 HDI PCB
Material: FR4 , 0.6mm, high TG, 0.5 OZ for all layer
Minimum tack: 3 mil
Minimum space(gap): 3 mil
Minimum hole: 0.15mm
Surface finished: ENIG
Panel size: 220*268mm/16up
Application: Communications devise
Characteristics: high density interconnect PCB, via on pad(plug with resin, copper capping), high TG, thin core 3mil thickness
high density interconnect PCB, via on pad(plug with resin, copper capping), high TG, thin core 3mil thickness
Communications facilities
PCB THAT YOU MAY LIKE
High Multilayer PCB
A Leading of High Multilayer PCB Manufacturer in China. How to Manufacture High Multilayer PCB?
Ultra HDI PCB
Ultra HDI PCB | Technology Comprehensive Guide. A Leading of Ultra HDI PCB Manufacturing in China
Birn in Board (BIB)
Birn in Board (BIB), high TG PCB, high multilayer PCB, hard gold PCB, IPC 6012 Class 3 PCB for semiconductor testing.
Probe Card PCB | Hard Gold PCB
The probe card is an element in semiconductor test systems. Some key points about probe cards:Some key points about probe cards
About HQ
Feedbacks from Main Customers
Company Profile
Human Resource
Enterprise Blueprint
Core Values & Enterprise Culture
Milestones
Organization
After Sales Service
Copyright © 1995-2025 All Rights Reserved. High Quality PCB Co., Limited
Track My Website