VIA ON PAD PCB, HDI PCB, MULTILAYER PCB
Layer count: 12 HDI PCB
Material: FR4 , 2.0mm, TG 180, 0.5 OZ for all layer
Minimum tack: 3.6mil
Minimum space(gap): 3.6mil
Minimum hole: 0.15mm
Surface finished: ENIG
Panel size: 120*268mm/10up
Characteristics: high density interconnect PCB, via on PAD (plug with resin, and plate copper flat), high TG
VIA ON PAD PCB, HDI PCB, MULTILAYER PCB
Communications equipment
