

IC Substrates for MEMS
Part No.: E0207060109C
Substrate thickness: 0.2+/-0.05mm
Layer count: 2 layer
Material: SI165
Sold mask: AUS308
Minimum trace: 80 um
Minimum space(gap): 25 um
Minimum hole: 0.15 mm
Surface finished: ENEPIG
Unit size: 3.76*2.95mm
Tenting, ENEPIG IC Substrates
IC Substrates for MEMS
MEMS sensors, namely micro-electro mechanical systems, are interdisciplinary frontier research fields developed on the basis of microelectronics technology. After more than 40 years of development, it has become one of the major scientific and technological fields attracting worldwide attention. It involves electronics, machinery, materials, physics, chemistry, biology, medicine and other disciplines and technologies, and has broad application prospects. By 2010, more than 600 units around the world were engaged in the development and production of MEMS, and hundreds of products including micro-pressure sensors, acceleration sensors, micro-inkjet printheads, and digital micro-mirror displays had been developed, of which MEMS sensors accounted for a large proportion. MEMS sensor is a new type of sensor manufactured by microelectronics and micromachining technology. Compared with traditional sensors, it has the characteristics of small size, light weight, low cost, low power consumption, high reliability, suitable for mass production, easy integration and intelligent realization. At the same time, the feature size at the micron level makes it possible to complete some functions that cannot be achieved by traditional mechanical sensors.