IC Substrates for MEMS

IC Substrates for MEMS

Part No.: E0207060109C

Substrate thickness: 0.2+/-0.05mm

Layer count:  2 layer

Material: SI165

Sold mask: AUS308

Minimum trace:  80 um

Minimum space(gap): 25 um

Minimum hole: 0.15 mm

Surface finished: ENEPIG

Unit size: 3.76*2.95mm



Tenting, ENEPIG IC Substrates 


IC Substrates for MEMS

MEMS sensors, namely micro-electro mechanical systems, are interdisciplinary frontier research fields developed on the basis of microelectronics technology. After more than 40 years of development, it has become one of the major scientific and technological fields attracting worldwide attention. It involves electronics, machinery, materials, physics, chemistry, biology, medicine and other disciplines and technologies, and has broad application prospects. By 2010, more than 600 units around the world were engaged in the development and production of MEMS, and hundreds of products including micro-pressure sensors, acceleration sensors, micro-inkjet printheads, and digital micro-mirror displays had been developed, of which MEMS sensors accounted for a large proportion. MEMS sensor is a new type of sensor manufactured by microelectronics and micromachining technology. Compared with traditional sensors, it has the characteristics of small size, light weight, low cost, low power consumption, high reliability, suitable for mass production, easy integration and intelligent realization. At the same time, the feature size at the micron level makes it possible to complete some functions that cannot be achieved by traditional mechanical sensors.