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Small Pitch BGA PCB Assembly

Small Pitch BGA PCB Assembly

HDI PCB Assembly
Small Pitch BGA PCB Assembly

Layer count: 6 Layer HDI PCB
Material: FR4, TG170 , 1.6 mm,  basic copper 0.5 OZ  for all layer
Minimum tack: 2.5 mil
Minimum space(gap): 2.5 mil
Minimum hole: 0.15mm
Surface finished: Immersion Gold
Panel size: 120*138mm/20up
Characteristics: 0.17mm BGA ball size, 0.35mm pitch BGA PCB assembly,  high density interconnect PCB, via on pad(plug with resin, copper capping), high TG, thin core 3mil thickness

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0.17mm BGA Ball Size PCB Assembly, 0.35mm Pitch BGA PCB Assembly

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