Part No.: E0215060183B

Layer count: 2 layer SAP flex PCB
Material: Polymide, 0.13mm, 1/3 OZ for all layer
Minimum trace: 2.0 mil
Minimum space (gap): 2.0 mil
Minimum hole: 0.15mm
Surface finished: immersion gold
Panel size: 75*13.5mm/1up

Application: wareable Devices
Characteristics: Flexible, 1mil Polymide, immersion gold, SAP flex PCB, flex connector for Iphone 15