IC Substrates for BGA, The full name of BGA is Ball Grid Array, which literally means grid array packaging.

IC Substrates for MEMS, MEMS sensors, namely micro-electro mechanical systems, are interdisciplinary frontier research fields developed on

IC Substrates for Trans-flash Card or Micro SD Card. Micro SD Card, formerly known as Trans-flash Card (TF card), was officially renamed Micro SD Card in 2004.

A Leading of Ceramic Substrates PCB manufacturing in China since 1995, single layer, double layer and copper dams projects are our advantages.

A leading of ceramic substrates manufacturer in China since 2016, from single layer to double layer, from 1 OZ to 10 OZ copper thickness are available.

Leading of IC substrates manufacturer in China since 2006, up to 8 layer, min trace/gap 15um projects are available for High Quality PCB.

A Leading of IC Substrates Manufacturing in China since 2006, High Quality PCB Co., Limited, MEMS is one of our IC substrates projects.

High Quality PCB Co., Limited is a leading of IC substrate manufacturing in China since 1995.

High Quality PCB Co., Limited is a leading of PCB manufacturer in China since 2006, up to 8 layers IC substrates is available.