Ic Substrates

Items

Technology capability

Layer count

2-8 layer

Min finished board thickness       

2 layer 

0.10mm

4 layer 

0.17mm

6 layer 

0.22mm

7 layer 

0.25mm

8 layer 

0.29mm

Min via/PAD

thru via/PAD

75um/155um

blind via/PAD

50um/130um

Min trace width/gap              

15um/15um

Solder mask registration

+/-20um

Special Process

Tenting

Etch Back

Buss-less

MSAP

SAP

Surface treatment

ENIG,ENEPIG,Soft Gold, Flash Gold,OSP...

Material Types

HL832-NX,MCL-E-679,HL832-NS,750G, DS-7409,FR5, ABF…