PCB Assembly
PCB Assembly
| SN | Items | Mass production | Small volume or prototype |
|---|---|---|---|
| 1 | Layer | 2 ~ 18 layers | 2 ~ 18 layers |
| 2 | Board types | Substrate-like PCB Assembly, SiP, SoC, BGA, Flip Chip, CSP, PBGA, TF card, SD card, Micro LED, HDI PCB, Rigid flex PCB | Substrate-like PCB assembly, SiP, SoC, BGA, Flip chip, CSP, PBGA, TF card, SD card, Micro LED, HDI PCB, Rigid flex PCB |
| 3 | Max dimesion | 80*800mm | 120*1200mm |
| 4 | Dimesional accuracy | +/-0.05mm | +/-0.05mm |
| 5 | Substrate Thickness | 0.02mm to 2.0mm | 0.02mm to 8.0mm |
| 6 | Min BGA pitch | 0.35mm | 0.25mm |
| 7 | Mini LED pitch | P0.9375 | P0.9375 |
| 8 | LED specification | IF1616-P0.9375 | IF1616-P0.9375 |